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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays. 1/12 tsz02201-0rgr0a600450-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14 ? 001 18.nov.2013 rev.003 low drop adjustable positive voltage regulator ba1117fp features ? low dropout voltage: - 1.2 v typ. (at i o = 1 a, 25 ) ? output current up to 1 a ? adjustable version availability (v ref = 1.25 v) ? internal current and thermal limit ? available in 1% (at 25 ) and 2% in full temperature range ? high supply voltage rejection: - 75 db typ. (at 25 ) ? temperature range: -20 to 105 ? designed to use by ceramic capacitors typical application description the ba1117fp is a low drop voltage regulator able to provide up to 1 a of output current, available in adjustable versions (v ref =1.25v). the device is supplied in: to252-3 and to220-3. surface mounted packages optimize the thermal characteristics while offering a relevant space saving advantage. high efficiency is assured by npn pass transistor. only a very common 22uf minimum capacitor is needed for stability. chip trimming allows the regulator to reach a very tight reference voltage tolerance, within 1% at 25 . table1. device summary order codes output voltage to252-3 to220-3 BA1117FP-E2 under development adjustable from 1.25 v to252-3 to220-3 22uf v ou t v in 10uf v ref r1 r2 i adj adj v ref = 1.25 v (typ.) i adj = 60 ua (typ.) v o = v ref (1 + r 2 / r 1 ) + i adj r 2 downloaded from: http:///
2/12 ba1117fp datasheet tsz02201-0rgr0a600450-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 18.nov.2013 rev.003 diagram figure 1. block diagram downloaded from: http:///
3/12 ba1117fp datasheet tsz02201-0rgr0a600450-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 18.nov.2013 rev.003 pin configuration figure 2. pin connections (top view) note1: the tab is connected to the v out . 1 2 3 adj v out v in to252-3 to220-3 adj v out v in 1 2 3 downloaded from: http:///
4/12 ba1117fp datasheet tsz02201-0rgr0a600450-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 18.nov.2013 rev.003 maximum ratings table 2. absolute maximum ratings note2: absolute maximum ratings are those values beyond which damage to the device may occur. functional operation under these condition is not implied. beyond the above suggested max. power dissipation, a short-circuit may permanently damage the device. note3: in case ta R 25 (70mm 70mm 1.6mm when mounted on a glass epox y board) is reduced by 9.6mw/ . table 3. thermal data symbol parameter value unit v in dc input voltage 15 v p d power dissipation 1.2 (note3) w t stg storage temperature range -55 to +150 t op operating junction temperature range -20 to +105 symbol parameter to252-3 to220-3 unit r thja thermal resistance junction-ambient 104.2 67.5 /w downloaded from: http:///
5/12 ba1117fp datasheet tsz02201-0rgr0a600450-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 18.nov.2013 rev.003 electrical characteristics refer to the test circuits, t j = -20 to 105 , c o = 22 uf, c i = 10 uf, unless otherwise specified. table 4. electrical characteristics of ba1117 (adjustable) symbol parameter test conditions min. typ. max. unit v o reference voltage v i = 5.3 v, i o = 10 ma, t j = 25 1.238 1.250 1.262 v v o reference voltage i o = 10 ma to 1 a, v i = 2.75 to 10 v 1.225 1.27 v S v o line regulation v i = 2.75 v to 8 v, i o = 0 ma 1 6 mv S v o load regulation v i = 2.75 v, i o = 0 to 1a 1 10 mv S v o temperature stability 0.5 % S v o long term stability 1000hrs, t j = 105 0.3 % v i operating input voltage i o = 100ma 10 v i adj adjustment pin current v i Q 10 v 60 120 ua S i adj adjustment pin current change v i - v o =1.4 to 10 v, i o = 10 ma to 1 a 0.2 5 ua i o(min) minimum load current v i = 10 v 1.7 5 ma i o output current v i - v o = 5 v, t j = 25 1000 1700 ma en output noise voltage b = 10 hz to 10 khz, t j = 25 100 uv svr supply voltage rejection i o = 40ma, f = 120 hz v i C v o = 3 v, v ripple = 1 v pp , 60 75 db v d dropout voltage i o = 100 ma 1 1.10 v i o = 500 ma 1.05 1.15 v i o = 1 a 1.20 1.40 v S v o(pwr) thermal regulation t a = 25 , 30 ms pulse 0.08 0.2 %/w downloaded from: http:///
6/12 ba1117fp datasheet tsz02201-0rgr0a600450-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 18.nov.2013 rev.003 electrical characteri stics (reference data) [] va [v] a [] va a [%] f [] a [] [] a [] t j = 105 t j = 25 figure 3. dropout voltage figure 4. temperature stability figure 5. supply voltage rejection figure 6. supply voltage rejection vs i o v ripple = 1 vpp i o = 0.5 a downloaded from: http:///
7/12 ba1117fp datasheet tsz02201-0rgr0a600450-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 18.nov.2013 rev.003 electrical characteri stics (reference data) a [] va vaa [%] a [] [] figure 7. load regulation i o = 1 a figure 8. adjustment pin current figure 10. load transient response [] v [v] figure 9. load regulation vs v o (0 0.5a) co=22f i o : 500 ma/div v o :dc : 1.5 v ac : 50 mv/div t : 4 us/div downloaded from: http:///
8/12 ba1117fp datasheet tsz02201-0rgr0a600450-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 18.nov.2013 rev.003 ba1117 adjustable: application note the ba1117 adjustable has a thermal stabilized 1.25 0.012v reference voltage between the v out and adj pins. i adj is 60ua typ. (120ua max.) and S i adj is 0.2ua typ(5ua max.). r 1 is normally fixed to 120 . v o = v ref + r 2 (i adj + i r1 ) = v ref + r 2 (i adj + v ref / r 1 ) = v ref (1 + r 2 / r 1 ) + r 2 i adj . in normal applications the r 2 value is in the range of a few k , so the r 2 i adj product can not be considered in the v o calculation; the above expression then becomes: v o = v ref (1 + r 2 / r 1 ). in order to have a better load regulation it is important to realize a good kelvin connection of r 1 and r 2 resistors. in particular, the r 1 connection must be realized very close to the v out and adj pins, while the r 2 ground connection must be placed as near as possible to the negative load pin. ripple rejection can be impr oved by introducing a 10uf electrolytic capacitor placed in parallel to the r 2 resistor (see figure 11, 12). the output capacitor is critical in maintaini ng regulator stability, and must meet the required conditions for both minimum amount of capacita nce and esr( equivalent series resistance). the minimum output capacitance required by the ba1117fp is 22uf, if a ceramic/tantalum capacitor is used. any increase of the output capacitance will mere ly improve the loop stability and transient response. the esr of the output tantalum capacitor should range between 0.3 - 5 . figure. 11 adjustable output voltage application figure. 12 adjustable output voltage application with improved ripple rejection 22uf v ou t v in 10uf v ref r1120 r2 adj 22uf v ou t v in 10uf v ref r1120 r2 adj 10 uf downloaded from: http:///
9/12 ba1117fp datasheet tsz02201-0rgr0a600450-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 18.nov.2013 rev.003 input- to-output capacitor it is recommended that a capacitor is placed very close between input pin and g nd, output pin and gnd. a capacitor, between input pin and gnd, is valid when the power supply impedance is high or the trace is long. also as for a capacitor, between output pin and gnd, the greater the capa city, more sustainable the line regulation and it makes improvement of the characterist ics depending on the load. however, please check the actual functionality of this part by mounting on a board for the actual applicat ion. ceramic capacitor usually have different, thermal and equivalent series characteristics, and moreover capacitance decreases gradually in use. for additional detail, please check the manufacturer, and sele ct the best ceramic capacitor for your application. dc bias voltage [v] ceramic capacitor capacity C dc bias characteristics (characteristics example) -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 01 234 rated voltage 10v aa rated voltage 4v x aa capacitance change [%] rated voltage:10v f characteristics rated voltage 6.3v aa aa rated voltage 10v downloaded from: http:///
10/12 ba1117fp datasheet tsz02201-0rgr0a600450-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 18.nov.2013 rev.003 operatinal notes (1). absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to ident ify damage mode, such as a short circuit or an open circuit. if there is any possibility of exposure over the rated values, please c onsider adding circuit protection devices, such as fuses. (2). connecting the power supply connector backward connecting of the power supply in reverse polarity can damage ic. take precautions when connecting the power supply lines. an external direction diode can be added. (3). power supply lines design pcb layout pattern to provide low impedance gnd and supply lines. to obtain a low noise ground and supply line, separate the ground section and s upply lines of the digital and analog blocks. furthermore, for all power supply terminals to ics, connect a capacitor between the power supply and the gnd terminal. when using electrolytic capacitors in the circuit, note that capacitance valu es are reduced at low temperaturesand over time. (4). gnd voltage the potential of gnd pin must be minimum potential under all operating conditions. (5). thermal design use a thermal design that allows for a sufficient margin in light of the power dissipati on (pd) in actual operating conditions. (6). inter-pin shorts and mounting errors use caution when positioning the ic for mounting on printed circuit boards. the ic may be damaged if there is any connection error or if pi ns are shorted together. (7). actions in strong electromagnetic field use caution when using the ic in the presence of a strong electromagnetic fi eld as this may cause the ic to malfunction. (8). aso when using the ic, set the output transistor so that it does not exceed absolute maximum ratings or aso. (9). thermal shutdown circuit the ic incorporates a built-in thermal shutdown circuit (tsd circuit). the thermal shutdown circuit (tsd circuit) is designed only to shut the ic off to prevent thermal runaw ay. it is not designed to protect the ic or guarantee its operation. do not continue to use the ic after operating this circuit or use the ic in an environment where the operation of this circuit is assumed. (10). testing on application boards when testing the ic on an application bo ard, connecting a capacitor to a pin with low impedance subjects the ic to stress. always discharge capacitors after each process or st ep. always turn the ics power supply before connecting it or removing it from a jig or fixt ure during the inspection process. ground the ic during assembly steps as an antistatic measure. use similar precauti on when transporting or storing the ic. downloaded from: http:///
11/12 ba1117fp datasheet tsz02201-0rgr0a600450-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 18.nov.2013 rev.003 (11). regarding input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adj acent elements in order to keep them isolated.p-n junctions are formed at the intersection of these p layers with the n layers of other elements, creating a parasitic diode or transistor. for example, the relation between each potential is as follows: when v o > pin a and v o > pin b, the p-n junction operates as a parasitic diode. when v o > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes can occur inevitable in the structure of the ic. the operation of parasitic diodes can result in mutual in terference among circuits, operational faults, or physical damage. accordingly, methods by which parasitic diodes operate, such as applying a vo ltage that is lower than the v o (p substrate) voltage to an input pin, should not be used. (12). ground wiring pattern. when using both small signal and large current gnd patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the grou nd potential of application so that t he pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern of any external components, either. parasitic element resistor transistor (npn) n n n p + p + p p substrate gnd pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a p aras iti c element pin b other adjacent elements e b c gnd p aras iti c element v o v o v o downloaded from: http:///
12/12 ba1117fp datasheet tsz02201-0rgr0a600450-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 18.nov.2013 rev.003 physical dimension/tape and reel information marking diagram (unit : mm) to252-3 2 1 3 0.8 0.65 0.65 1.5 2.5 0.75 fin 6.5 0.2 2.3 0.2 2.3 0.2 0.5 0.1 1.0 0.2 2.3 0.2 9.5 0.5 0.5 0.1 5.5 0.2 1.5 0.2 5.1 +0.2 - 0.1 c0.5 direction of feed 1pin reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the lower left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 ( ) to252-3 (top view) part number marking lot number ba1117 (unit : mm) to220fp-3 23 1 + 0.4 3.2 0.1 0.55 17.0 12.0 0.2 8.0 0.2 2.54 0.5 13.5min. 5.0 0.2 0.8 2.54 0.5 1.3 0.1 + 0.3 10.0 7.0 1.8 0.2 0.2 0.1 + 0.3 2.6 0.5 0.05 + 0.1 + 0.2 0.1 0.1 + 0.3 4.5 2.8 ? order quantity needs to be multiple of the minimum quantity. tube containerquantity direction of feed 500pcs direction of products is fixed in a container tube to220fp-3 (top view) ba1117 part number marking lot number downloaded from: http:///
datasheet datasheet notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet datasheet notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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